Publication | Closed Access
The impact of silicon brick polishing on thin (120 μm) silicon wafer sawing yields and fracture strengths in diamond-wire sawing
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Citations
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References
2019
Year
Materials ScienceWafer Scale ProcessingDiamond-wire SawingEngineeringMicrofabricationMaterial MachiningTool WearMechanical EngineeringSemiconductor Device FabricationSilicon BrickFracture StrengthsMechanics Of MaterialsMicrostructure
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