Concepedia

Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material

Kim S. Siow, S. T. Chua

Metals and Materials International · 2019 · 19 citations · 27 references

DOI

Concepts

References

27

The Thermal Expansion of Pure Metals: Copper, Gold, Aluminum, Nickel, and Iron

Foster C. Nix, D. MacNair · Physical Review · 1941 · 660 citations

, , +17

Reduction of CuO and Cu<sub>2</sub>O with H<sub>2</sub>: H Embedding and Kinetic Effects in the Formation of Suboxides

Jae Y. Kim, José A. Rodríguez, Jonathan C. Hanson et al. · Journal of the American Chemical Society · 2003 · 576 citations

, , +14

Mechanical properties of nano-silver joints as die attach materials

Kim S. Siow · Journal of Alloys and Compounds · 2011 · 384 citations

, , +12

Microstructure and mechanical behavior of porous sintered steels

Nikhilesh Chawla, Xin Deng · Materials Science and Engineering A · 2004 · 320 citations

, , +12

Brief review of oxidation kinetics of copper at 350 °C to 1050 °C

Kouji Mimura, Jae‐Won Lim, Minoru Isshiki et al. · Metallurgical and Materials Transactions A · 2006 · 212 citations

, , +13