International Journal of Security and Its Applications · 2015 · 16 citations · 6 references
EngineeringComputer EngineeringComputer SystemsInternet Of ThingsLow-power DesignThermal AnalysisEmbedded System SecurityLow-power Fpga DesignPower ManagementPower-aware DesignThermal DesignThermal ManagementEncoder DesignLeakageLeakage PowerLeakage Power EstimationLeakage Power OptimizationThermal Management In Reconfigurable SystemsThermal StabilityThermal-aware Design
In this work, we are going to use thermal aware approach in Encoder design and also testing thermal stability by working on different ambient temperatures 298.15K, 308.15K, 318.15K, 328,15K, 338.15K and 348.15K and 358.15K. We have observe the compatibility of our device with wireless network by working on different I/O standards (LVCMOS15 and LVCMOS25) . There is 30.29% reduction in leakage power, when we scale down temperature from 358.15K to 298.15K using LVCMOS15 as I/O standard on 40nm Virtex FPGA. Leakage power is calculated for 65nm FPGA and 90nm FPGA as well .In this work, we are using Verilog Hardware Description Language.
6
Smart objects as building blocks for the Internet of things
Gerd Kortuem, Fahim Kawsar, V. Sundramoorthy et al. · IEEE Internet Computing · 2009 · 1.5K citations · Full text