Publication | Open Access
TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages
10
Citations
9
References
2019
Year
Quad Flat PackagesEngineeringEnergy EfficiencyRefrigerationNumerical SimulationThermal ResistanceThermal AnalysisThermal ModelingThermodynamicsElectronic PackagingThermal ConductionDevice ModelingElectrical EngineeringThermal ModelElectronic PackagesComputer EngineeringHeat TransferMicroelectronicsThermal EngineeringCircuit Simulation
This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary in a chosen set. Additionally, it can apply a novel model-order reduction-based approach for the automatic and fast extraction of a parametric compact thermal model of such packages. Furthermore, it is suited to automatically determine the joint electron device engineering council (JEDEC) thermal metrics for any choice of parameters in a negligible amount of time. The tool was validated through the analysis of two families of quad flat packages.
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