Publication | Closed Access
Direct surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film
16
Citations
37
References
2019
Year
Materials ScienceConducting PolymerEngineeringElectroless DepositionSurface ScienceApplied PhysicsPolyimide FilmChemical DepositionThin Film ProcessingElectrochemistryElectrical Insulation
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