Xinhong Su

Statistics

Publications

Citations

252

H-Index

Active since

2014

Affiliations

University of Electronic Science and Technology of China(Current)

Guangdong Testing Institute for Product Quality Supervision

National Engineering Research Center of Electromagnetic Radiation Control Materials

Xinhong Su is an author at University of Electronic Science and Technology of China specializing in natural sciences, materials science, and materials engineering.

Publications per year

2014–2022

Publications

Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination

Chong Wang, Na Wen, Guoyun Zhou et al. · Applied Surface Science · 2017 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +10

Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence

Zhiqiang Lai, Chong Wang, Yunzhong Huang et al. · Materials Today Communications · 2020 · 33 citations

Natural Sciences, Materials Engineering, Materials Science +12

Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Yan Hong, Xiangqing You, Yi Zeng et al. · Vacuum · 2019 · 27 citations

Engineering, Electrical Engineering, Materials Engineering +13

Investigation of polyvinylpyrrolidone as an inhibitor for trench super-filling of cobalt electrodeposition

Xiuren Ni, Yuanming Chen, Xiaofeng Jin et al. · Journal of the Taiwan Institute of Chemical Engineers · 2020 · 27 citations

Natural Sciences, Chemistry, Materials Science +11

Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles

Jiujuan Li, Guoyun Zhou, Xiaofeng Jin et al. · Composites Part B Engineering · 2018 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +16

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