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Stress and frequency analysis of silicon diaphragm of MEMS based piezoresistive pressure sensor
19
Citations
8
References
2019
Year
EngineeringMechanical EngineeringDynamic Silicon DiaphragmSensor TechnologyMicro-electromechanical SystemMechanicsPiezoelectric MaterialInstrumentationMems Pressure SensorFrequency AnalysisHigh SensitivitySilicon DiaphragmMechatronicsPiezoelectricityMicrofabricationPiezoelectric NanogeneratorsPiezoresistive Pressure SensorMechanical SystemsStructural MechanicsVibration ControlMicromachined Ultrasonic Transducer
This paper reports the stress and frequency analysis of dynamic silicon diaphragm during the simulation of micro-electro-mechanical-systems (MEMS) based piezoresistive pressure sensor with the help of finite element method (FEM) within the frame work of COMSOL software. Vibrational modes of rectangular diaphragm of piezoresistive pressure sensor have been determined at different frequencies for different pressure ranges. Optimal frequency range for particular applications for any diaphragm is a very important so that MEMS sensors performance should not degrade during the dynamic environment. Therefore, for the MEMS pressure sensor having applications in dynamic environment, the diaphragm frequency of 280 KHz has been optimized for the diaphragm thickness of 50 [Formula: see text]m and hence this frequency can be considered for showing the better piezoresistive effect and high sensitivity. Moreover, the designed pressure sensor shows the high linearity and enhanced sensitivity of the order of ([Formula: see text]0.5066 mV/psi).
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