Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance - Concepedia

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Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance

166

Citations

22

References

2018

Year

Ki Wook Jung, Chirag R. Kharangate, Hyoungsoon Lee, James W. Palko, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson

International Journal of Heat and Mass Transfer

Electrical EngineeringEngineeringLiquid Metal CoolingHeat ExchangerHeat Transfer EnhancementThermal ManagementThermodynamicsThermal ModelingHeat TransferSingle-phase Thermal-fluid PerformanceThermal EngineeringRefrigeration

References

	Year	Citations

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