Publication | Closed Access
Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature
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Citations
22
References
2018
Year
Materials EngineeringMaterials ScienceSemiconductor TechnologyEngineeringApplied PhysicsDirect BondingSemiconductor Device FabricationStructural CeramicSilicon On InsulatorCarbideLow Temperature
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