Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature

Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices

Fengwen Mu, Ran He, Tadatomo Suga · Scripta Materialia · 2018 · 136 citations

Engineering, Materials Engineering, Materials Science +12

Closure and Repropagation of Healed Cracks in Silicate Glass

Terry A. Michalské, Edwin R. Fuller · Journal of the American Ceramic Society · 1985 · 120 citations

Natural Sciences, Materials Engineering, Materials Science +17

Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz <i>via</i> VUV/O₃ activation

Jikai Xu, Chenxi Wang, Te Wang et al. · RSC Advances · 2018 · 70 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Study of structural and electronic environments of hydrogenated amorphous silicon carbonitride (a-SiCN:H) films deposited by hot wire chemical vapor deposition

Bibhu P. Swain, Nong‐Moon Hwang · Applied Surface Science · 2008 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effects of thermal annealing process on the electrical properties of p+-Si/n-SiC heterojunctions

Jianbo Liang, Shota Nishida, M. Arai et al. · Applied Physics Letters · 2014 · 54 citations · Full text

Engineering, Electrical Engineering, Materials Science +17