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Direct Ag-Ag bonding by in-situ reduction of surface oxides for advanced chip-package interconnection

Materials EngineeringMaterials ScienceElectrical EngineeringDirect Ag-ag BondingEngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)Chip On BoardSurface ScienceApplied PhysicsChip AttachmentAdvanced Chip-package InterconnectionElectronic PackagingMicroelectronicsSurface Oxides