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Anisotropic grain growth to eliminate bonding interfaces in direct copper-to-copper joints using <111>-oriented nanotwinned copper films

Materials ScienceMaterials EngineeringEngineeringNanotwinned Copper FilmsNanotechnologyMechanical EngineeringApplied PhysicsSurface ScienceMetallurgical InteractionAnisotropic Grain GrowthBonding InterfacesThin FilmsInterface Structure