Concepedia

Publication | Closed Access

The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

DOI

68

Citations

53

References

2018

Year

C. C. Liao, Shengtao Zhang, Shijin Chen, Yujie Qiang, Gen Liu, Mingxing Tang, Bochuan Tan, Denglin Fu, Yue Xu
Journal of Electroanalytical Chemistry

References

YearCitations

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