Publication | Open Access

Compatibility of 3-D printed devices in cleanroom environments for semiconductor processing

3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationDigital FabricationPrinted Electronics3-D Printed DevicesSemiconductor ProcessingComputer-aided DesignCleanroom EnvironmentsElectronic Packaging3D Printing