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Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

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Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

Jingdong Liu, Hongtao Chen, Hongjun Ji et al. · ACS Applied Materials & Interfaces · 2016 · 223 citations

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