Publication | Closed Access
Substrate Integrated Waveguides for mm-wave Functionalized Silicon Interposer
24
Citations
9
References
2018
Year
Unknown Venue
EngineeringDevice IntegrationMicrowave TransmissionIntegrated CircuitsAttenuation ConstantSilicon On InsulatorInterconnect (Integrated Circuits)Electromagnetic CompatibilityAdvanced Packaging (Semiconductors)Electronic PackagingPlanar Waveguide SensorD-band Mm-wave SiwsElectrical EngineeringSubstrate Integrated WaveguidesAntennaInterposer ThicknessMillimeter Wave TechnologyMicroelectronicsMicrowave EngineeringMicrofabricationOptoelectronics
This paper presents D-band mm-wave SIWs, which are embedded in a high-resistivity silicon interposer. Thanks to the interposer thickness equal to 70 μm, high-performance SIW were obtained, with measured attenuation constant between 0.4 and 0.6 dB/mm from 110 GHz to 170 GHz. These first results pave the way for the realization of high performance passive circuits and antennas embedded in the interposer. Also, by using a fully shielded waveguide highly insensitive to adjacent wave-guiding and radiating structures, this topology provides significant advantages for packaging solutions at mm-wave frequencies. Such a functionalized interposer could offer lower cost, higher electrical performance as compared to standard CMOS technologies.
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