Toward CMOS compatible wafer-scale fabrication of carbon-based microsupercapacitors for IoT

Anderson D. Smith, Qi Li, Andrew E. Anderson, Agin Vyas, Volodymyr Kuzmenko, Mazharul Haque, L.G.H. Staaf, Per Lundgren, Peter Enoksson

Journal of Physics Conference Series · 2018 · 11 citations · 8 references

DOIFull text

Open access

Concepts

Abstract

This work presents a wafer-scale method of microsupercapacitor (MSC) fabrication. Deposition of the electrode precursor, i.e. graphene oxide, is accomplished through spin-coating which allows for potential application in CMOS compatible processes for future integrated on-chip energy storage systems. Our MSCs have an areal capacitance of 0.4 mF/cm2 at 10 µA, which is a very promising result. Further, the MSC has good rate capability as its capacitance decreases by only 0.03 mF/cm2 when the current increases to 50 µA. The MSCs have a maximum energy density of 0.04 µWh/cm2 and a maximum power density as high as 96 µW/cm2. Additionally, the wafer-scale process demonstrates industrial viability.

References

8