Picoliter Solder Droplet Dispensing

Abstract

A device based on ink-jet printing technology was used to produce and place
\nmolten solder droplets, approximately 25-125pm in diameter, onto substrates. The
\nadvantages of an ink-jet based system are direct production of metallic objects, no postcure,
\nlow cost, and the repeatability and resolution for small feature sizes. This paper
\ndescribes the device, the supporting hardware, and experimental procedures. Results show
\nthat bump size can be varied by placing in quick succession, multiple droplets as well as
\nby resizing the device and by altering the signal.