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Evaluation of structural design methodologies for predicting mechanical reliability of solder joint of BGA and TSSOP under launch random vibration excitation

Solder JointStructural IntegrityEngineeringReliability EngineeringStructural Design MethodologiesMechanical EngineeringMechanical SystemsStructural AnalysisStructural Health MonitoringStructural DesignStructural ReliabilityStructural OptimizationMechanical ReliabilityStructural MechanicsVibration ControlStructural EngineeringStructural Vibration