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Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

Xavier de la Broïse, A. Le Coguie, Jean-Luc Sauvageot, C. Pigot, X. Coppolani, Vincent Moreau, Samuel d’Hollosy, Timur Knarosovski, Andreas Engel

Journal of Low Temperature Physics · 2018 · 12 citations · 1 references

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X-IFU technical challenge

Thien Lam Trong · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2016 · 13 citations

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