Publication | Closed Access
Effects of Amplitude Variations on Deformation and Damage Evolution in SnAgCu Solder in Isothermal Cycling
18
Citations
30
References
2018
Year
Materials ScienceEngineeringIsothermal CyclingHot WorkingSnagcu SolderThermodynamicsElectronic PackagingHeat TransferThermomechanical AnalysisThermal EngineeringMechanics Of MaterialsMicrostructureAmplitude Variations
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