The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints - Concepedia

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The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints

31

Citations

27

References

2017

Year

Yu Tian, Jing Han, Limin Ma, Fu Guo

Microelectronics Reliability

Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringCorrosionApplied PhysicsMetallurgical InteractionDominant EffectC-axis OrientationElectronic PackagingElectromigration BehaviorsMicrostructure

References

	Year	Citations

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