IEEE Journal of Solid-State Circuits · 2017 · 55 citations · 28 references
EngineeringComputer EngineeringElectrical EngineeringOptoelectronicsPhotonicsSystem-on-chip DesignCmos Circuit DesignIntegrated Circuit DesignIntegrated OpticsIntegrated PhotonicsOptical AmplifiersOptical Communication SystemsBandwidthLink Margin AnalysisOptical Link DesignOptical LossesOptical PackagingSensitivityTransimpedance Amplifier DesignTransimpedance Amplifiers
This paper presents a 32 Gb/s non-return-to-zero optical link using 850-nm vertical-cavity surface-emitting laser-based multi-mode optics with 14-nm bulk FinFET CMOS circuits. The target application is the integration of optics on to the first-level package, connecting high-speed optical I/O directly to an advanced CMOS host chip (e.g., processor and switch) to increase package I/O bandwidth density and lower overall system power and cost. The optical link is designed for maximum link margin to tolerate high optical losses created by low-cost optical packaging. The transmitter (TX) uses a three-tap, 1/2-unit-interval-spaced feed-forward equalizer to improve eye opening. The receiver (RX) uses a low-bandwidth, low-noise transimpedance amplifier and a speculative one-tap decision-feedback equalizer for high sensitivity. The TX and RX power efficiencies are 3.3 and 1.4 pJ/bit, respectively. The TX optical modulation amplitude (OMA) is 1.2 dBm, and the RX sensitivity is -11.7 dBm OMA at a bit error rate of 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-12</sup> with PRBS31 data, providing 12.9-dB link margin.
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Hiroshi Kimura, Pervez Aziz, Tai Jing et al. · IEEE Journal of Solid-State Circuits · 2014 · 96 citations · Full text