Ortho-Mode Sub-THz Interconnect Channel for Planar Chip-to-Chip Communications

Bo Yu, Yu Ye, Xuan Ding, Yuhao Liu, Zhiwei Xu, Xiaoguang Liu, Qun Jane Gu

IEEE Transactions on Microwave Theory and Techniques · 2017 · 55 citations · 35 references

Concepts

Abstract

This paper presents for the first time the design, fabrication, and demonstration of a dielectric waveguide (DWG)-based ortho-mode sub-THz interconnect channel for planar chip-to-chip communications. By combining the proposed new transition of microstrip line with DWG orthogonally, the ortho-mode transition is constructed to form an ortho-mode channel. The measured minimum insertion losses for the y <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sub> mode and the E <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x11</sub> mode are 6.6 dB with 20.3-GHz 3-dB bandwidth and 6.5 dB with 55.2-GHz 3-dB bandwidth, respectively. The simulation and measurement results agree well with each other.

References

35