Concepedia

Publication | Open Access

Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

DOIFull Paper Access

53

Citations

51

References

2017

Year

Yuan-Wei Chang, Yin Cheng, Lukas Helfen, Feng Xu, Tian Tian, Mario Scheel, Marco Di Michiel, Chih Chen, K. N. Tu, Tilo Baumbach
Scientific Reports

References

YearCitations

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