I.H.P. SAW technology and its application to micro acoustic components

Abstract

I.H.P. SAW (Incredible High-Performance SAW) has a novel multi-layered structure to confine SAW energy in substrate surface area, and it shows extremely high quality (Q) factor, low temperature coefficient of frequency (TCF) and improved electromechanical coupling coefficient (K2). This paper introduces its mechanism of the high acoustic Q factor, both theoretically and experimentally, and its applications to new LTE band filters and multiplexers for Carrier Aggregation service.