Ceramics International · 2017 · 29 citations · 6 references
Materials ScienceSilver-based FilmsElectrical EngineeringEngineeringSurface ScienceApplied PhysicsMetallic NanomaterialsThin FilmsElectrical PropertyThin Film ProcessingElectrical Insulation
6
Interaction between Alumina and Binary Glasses
Yoshirou Kuromitsu, Hideaki Yoshida, Hiromichi Takebe et al. · Journal of the American Ceramic Society · 1997 · 52 citations
Copper thick-film substrates for power electronic applications
Thomas Blank, Benjamin Leyrer, Tobias Maurer et al. · 2014 · 18 citations
Materials Science, Advanced Packaging, Electrical Engineering +13
Thick Printed Copper as Highly Reliable Substrate Technology for Power Electronics
Paul Gundel, Melanie Bawohl, Mark Challingsworth et al. · PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of · 2015 · 14 citations
Copper Paste Technology, Engineering, Mechanical Engineering +18