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DC and RF Performance of AlGaN/GaN/SiC MOSHEMTs With Deep Sub-Micron T-Gates and Atomic Layer Epitaxy MgCaO as Gate Dielectric
43
Citations
26
References
2017
Year
Materials EngineeringSemiconductorsElectrical EngineeringWide-bandgap SemiconductorEngineeringHigh On/off RatioRf SemiconductorSemiconductor TechnologyApplied PhysicsQuantum MaterialsAluminum Gallium NitrideGan Power DeviceWide-bandgap SemiconductorsInline-formula XmlnsCategoryiii-v SemiconductorAlgan/gan/sic MoshemtsGate DielectricDeep Sub-micron T-gates
In this letter, we report on the dc and RF performance of AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistors (MOSHEMTs) with various gate lengths ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${L}_{\mathsf {G}}$ </tex-math></inline-formula> ) from 90 to 500 nm using atomic-layer-epitaxy single crystalline Mg <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.25</sub> Ca <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.75</sub> O as gate dielectric. The 90-nm T-gate MOSHEMT simultaneously demonstrates a f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">t</sub> /f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> of 113/160 GHz with high on/off ratio of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$5\times 10^{8}$ </tex-math></inline-formula> . The on/off ratio increases to <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2\times 10^{11}$ </tex-math></inline-formula> at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${L}_{\mathsf {G}}=350$ </tex-math></inline-formula> nm by reducing short channel effects. The gate leakage current is around 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−11</sup> A/mm at off-state and 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−5</sup> A/mm at on-state. A 160 nm <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${L}_{\mathsf {G}}$ </tex-math></inline-formula> MOSHEMT also exhibits an output power density of 4.18 W/mm at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${f} = 35$ </tex-math></inline-formula> GHz and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\mathsf {DS}}=20$ </tex-math></inline-formula> V. MgCaO demonstrates to be a promising dielectric for GaN MOS technology in serving as the surface passivation layer and reducing the gate leakage current while maintaining high RF performances for high-power applications.
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