IEEE Microwave and Wireless Components Letters · 2017 · 39 citations · 7 references
EngineeringElectrical EngineeringAnalog ElectronicsMicroelectronicsMicrowave EngineeringHigh-frequency Semiconductor DevicesMicrowave Integrated CircuitsMicrowave Semiconductor DevicesMillimeter-wave CommunicationsMixed-signal Integrated Circuit DesignRadio-frequency Integrated CircuitsBandwidthBicmos TechnologyDirect Conversion ReceiversMillimeter-wave Integrated CircuitsMillimeter-wave ReceiversMixersTransimpedance Amplifier DesignTransimpedance Amplifiers
This letter presents a wideband 240-GHz direct-conversion receiver manufactured in a 130-nm SiGe:C BiCMOS technology with f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> /f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> =300/500 GHz. A mixer-first receiver is implemented, with a new dc offset cancellation loop architecture to compensate for the mixer dc offsets and biasing purposes. A transimpedance amplifier is utilized as a load for the mixer, optimized with the dc offset cancellation loop to maximize the bandwidth. A local oscillator (LO) chain that multiplies by 8 a 30-GHz input signal drives the mixer. The proposed receiver achieves the widest 3-dB bandwidth among the published works of 55 GHz, with a conversion gain of 13 dB. The measured average single-sideband noise figure is 18 dB. It dissipates 500 mW, while occupying 1.25 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , requiring LO input signal of only -10 dBm.
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