IEEE Electron Device Letters · 2017 · 20 citations · 8 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringSemiconductor DevicesComplementary Metal-oxide-semiconductor TechnologyHigh-frequency Semiconductor DevicesIntegrated Circuit DesignMicrowave Integrated CircuitsMicrowave PackagingMicrowave Semiconductor DevicesCapacitorsDe-embedding TechniquesHigh-frequency OperationHigh-frequency PerformanceMillimeter-wave Integrated CircuitsMillimeter-wave TransistorsMonolithic Microwave Integrated Circuits
In this letter, a cascade-based de-embedding method with thru-halfthru-short structures is presented for millimeter-wave on-wafer device characterization. Distributed effects of interconnect, discontinuity between pad and interconnect, and transistor-access-via-holes are all well considered using only three dummy structures, and forward coupling is also investigated. By providing both extracted junction capacitors and S-parameter results of 0.5-μm InP DHBT transistor using proposed and existing de-embedding methods up to 220 GHz, better high frequency performance and particularly 21° improvement in phase accuracy for S <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">11</sub> as well as 12° for S <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">21</sub> at 220 GHz are obtained compared with the state-of-the-art cascade-based method.
8
E.P. Vandamme, Dominique Schreurs, G. Van Dinther · IEEE Transactions on Electron Devices · 2001 · 256 citations