Publication | Closed Access
Enhancing thermoelectric performance in hierarchically structured BiCuSeO by increasing bond covalency and weakening carrier–phonon coupling
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Citations
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References
2017
Year
Materials ScienceMaterials EngineeringThermoelectric PerformanceEngineeringBond CovalencyCarrier MobilityThermal TransportApplied PhysicsQuantum MaterialsCondensed Matter PhysicsThermoelectricsPhononThermophysical PropertyThermoelectric MaterialThermodynamicsChemistryFunctional MaterialsThermal Conductivity
Improved thermoelectric performance of BiCuSeO <italic>via</italic> increased bond covalency and carrier mobility.
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