Enhanced thermal conductivity of metallic nanoparticle packed bed by sintering treatment

High-temperature electronics - a role for wide bandgap semiconductors?

Philip G. Neudeck, Robert S. Okojie, Liang-Yü Chen · Proceedings of the IEEE · 2002 · 987 citations

Semiconductors, Wide-bandgap Semiconductor, Electrical Engineering +14

Metal–metal bonding process using Ag metallo-organic nanoparticles

Eiichi Ide, Shinji Angata, Akio Hirose et al. · Acta Materialia · 2005 · 492 citations

Materials Science, Engineering, Metal Nanoparticles +5

Transient ballistic and diffusive phonon heat transport in thin films

Abhishek Joshi, Arun Majumdar · Journal of Applied Physics · 1993 · 406 citations

Radiative Heat Transfer, Engineering, Thermal Conductivity +16

Preparation of PVP coated Cu NPs and the application for low-temperature bonding

Jianfeng Yan, Zou Guisheng, Anming Hu et al. · Journal of Materials Chemistry · 2011 · 221 citations

Engineering, Low-temperature Bonding, Ag Nanoparticles +19

Fabrication of B4C particulate reinforced magnesium matrix composite by powder metallurgy

Qi–Chuan Jiang, H.Y. Wang, Bing Ma et al. · Journal of Alloys and Compounds · 2004 · 221 citations

Materials Science, Metal Matrix Composite, Engineering +9