IEEE Transactions on Instrumentation and Measurement · 2017 · 15 citations · 22 references
EngineeringComputer EngineeringElectrical EngineeringLow-power DesignMicroelectronicsWireless CommunicationsHigh-frequency Power ConversionHigh-frequency Semiconductor DevicesMicrowave Integrated CircuitsMicrowave OscillatorsRadio-frequency Integrated CircuitsWireless Power TransferInductorsOn-wafer MeasurementPower OutputPower Transfer EfficiencyRadio Frequency TransceiversTransceiver ArchitecturesTransceiver DesignTransmitter Design
In this paper, we propose a transceiver architecture for wireless on-wafer test systems. To obtain a compact transceiver, the dc-ac converter, an essential component in typical wireless power transfer (WPT) systems, is removed. Instead of the converter, the output power of the oscillator is used as the transmitted power in the transmitter. To reduce the number of required inductors in the transceiver and, hence, the chip size, the inductor of the cross-coupled oscillator is used as the transmitter coil. Consequently, the proposed transceiver becomes sufficiently simple and compact to be applied to wireless on-wafer test systems. To verify the feasibility of the proposed topology, we designed the proposed transceiver using the 180-nm RFCMOS technology. From the measurement results of various designed transmitters and receivers, we obtain a maximum efficiency of 37% when the transmitter power is approximately 11.5 dBm. From the measured results, we successfully prove the feasibility of the proposed transceiver for wireless on-wafer test systems.
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Simple accurate expressions for planar spiral inductances
S.S. Mohan, M. del Mar Hershenson, Stephen Boyd et al. · IEEE Journal of Solid-State Circuits · 1999 · 1.6K citations