Printed strain sensor with temperature compensation and its evaluation with an example of applications in structural health monitoring

Daniel Żymełka, Takahiro Yamashita, Seiichi Takamatsu, Toshihiro Itoh, Takeshi Kobayashi

Japanese Journal of Applied Physics · 2017 · 33 citations · 23 references

Concepts

Abstract

In this paper, we describe the development of a flexible printed strain sensor and its evaluation with an example of its applications to structural health monitoring. The sensor was fabricated on a thin poly(ethylene naphthalate) (PEN) substrate using the screen printing method. In order to ensure compensation for temperature variations, a full-Wheatstone-bridge circuit was integrated into the sensor's structure. For this reason, the sensor's shape was specially designed in such a way that only one symmetrical structure was enough to build the full-Wheatstone-bridge. The developed device was evaluated by various laboratory tests as well as by measurements carried out on a highway bridge. The collected results demonstrate its potential suitability for application to dynamic load tests within the framework of structural health monitoring.

References

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