First demonstration of a back-side integrated heterogeneous hybrid III-V/Si DBR lasers for Si-photonics applications

Abstract

In this paper, we demonstrate for the first time the integration of a III-V/Si hybrid laser on the back-side of a SOI wafer. This integration allows preserving the compatibility with Si-waveguide integration and with CMOS front-side metal interconnects, while leveraging passive and active photonic device design.