Publication | Open Access
Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection
11
Citations
16
References
2017
Year
Electrical EngineeringEngineeringElectronic AssembliesThermal TransportApplied PhysicsThermal ManagementThermal StateQfn64 DeviceThermal AnalysisThermal ModelingThermodynamicsHeat TransferElectronic PackagingMicroelectronicsThermal EngineeringThermal InsulationRefrigeration
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