Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C - Concepedia

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Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C

14

Citations

30

References

2016

Year

Jian Peng, R. C. Wang, Mian Wang, Huashan Liu

Journal of Electronic Materials

Materials ScienceInterfacial Microstructure EvolutionShear BehaviorEngineeringMechanical PropertiesMechanical EngineeringApplied PhysicsMetallurgical InteractionMicrostructure-strength RelationshipAu-sn/ni-xcu JointsMechanics Of MaterialsMicrostructure

References

	Year	Citations

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