Review and outlook of HVDC grids as backbone of the transmission system

Mian Wang, Ting An, Hakan Ergun, +6

CSEE Journal of Power and Energy Systems

Electrical EngineeringEngineeringPower Grid OperationSmart GridEnergy Management +12

Effect of Si addition on microstructure and properties of magnesium alloys with high Al and Zn contents

Mian Wang, Daihong Xiao, W.S. Liu

Vacuum

Materials EngineeringMaterials ScienceMagnesium AlloysZn ContentsEngineering +7

Substations for Future HVdc Grids: Equipment and Configurations for Connection of HVdc Network Elements

Dirk Van Hertem, Willem Leterme, Geraint Chaffey, +4

IEEE Power and Energy Magazine

EngineeringSubstation WorkPower ElectronicsGrid NetworkHvdc Grids +15

Pole Rebalancing Methods for Pole-to-Ground Faults in Symmetrical Monopolar HVDC Grids

Mian Wang, Willem Leterme, Geraint Chaffey, +2

IEEE Transactions on Power Delivery

Electrical EngineeringEngineeringPower Grid OperationSmart GridHvdc Grids +12

Frequency domain based DC fault analysis for bipolar HVDC grids

Mian Wang, Jef Beerten, Dirk Van Hertem

Journal of Modern Power Systems and Clean Energy

Unraveling dislocation-based strengthening in refractory multi-principal element alloys

Tianyi Wang, Jiuyin Li, Mian Wang, +4

npj Computational Materials

Materials ScienceShort-range OrderSingle DislocationDislocation-based StrengtheningMechanical Properties +13

Impact of DC grid contingencies on AC system stability

Mudar Abedrabbo, Mian Wang, Pieter Tielens, +4

Electrical EngineeringLarge Dc GridsEngineeringSmart GridDifferent Protection Strategies +9

Backup Protection Algorithm for Failures in Modular DC Circuit Breakers

Mian Wang, Mario Zaja, Jef Beerten, +2

IEEE Transactions on Power Delivery

Electrical EngineeringReliability EngineeringEngineeringSmart GridPower System Reliability +11

Multi‐vendor interoperability in HVDC grid protection: State‐of‐the‐art and challenges ahead

Mian Wang, Willem Leterme, Geraint Chaffey, +2

IET Generation Transmission & Distribution

Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C

Jian Peng, R. C. Wang, Mian Wang, +1

Journal of Electronic Materials

Materials ScienceInterfacial Microstructure EvolutionShear BehaviorEngineeringMechanical Properties +7