Folded U-shaped micro-wire technology for GaAs IC interconnections

Abstract

A novel microwire structure with folded U-shape cross section has been developed for application in GaAs IC interconnections. The structure enhances the mechanical strength and makes it possible to form an air-bridge with a 3-mm-long reach. Evaluations of the high-frequency characteristics of the wire in a transmission line reveal that this technology can be applied in microwave circuits. This technology makes it possible to transmit a microwave efficiently with a miniaturized coplanar type transmission line. This technology should prove very attractive for developing high-speed GaAs LSIs and compact monolithic microwave integrated circuits.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>