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Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler

DOI

24

Citations

15

References

2016

Year

Lanxian Cheng, M.R. Liu, X.Q. Wang, Bingdong Yan, G.Y. Li
Materials Science and Engineering A

References

YearCitations

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