Publication | Closed Access
Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration
89
Citations
9
References
2016
Year
Materials ScienceMaterials EngineeringElectromigration TechniqueEngineeringApplied PhysicsMetallurgical InteractionChemistryCu6sn5 Intermetallic CompoundsSn Grain OrientationElectrochemical InterfaceElectrochemistry
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