IEEE Design and Test · 2015 · 27 citations · 22 references
EngineeringComputer EngineeringInterconnection NetworksLow-power DesignSystem-on-chip DesignChip PackagingDigital Integrated Circuit DesignIntegrated Circuit DesignIntegrated Circuit FabricationInterconnect DesignInterconnect Technology3D Integrated CircuitsBandwidthPower ConsumptionPower Consumption OptimizationThree-dimensional Integrated Circuit InterconnectsThree-dimensional Integrated Circuit LayoutThree-dimensional Integrated Circuit RoutingThree-dimensional Integration
Three-dimensional (3-D) integration, a breakthrough technology to achieve “More Moore and More Than Moore,” provides numerous benefits, e.g., higher performance, lower power consumption, and higher bandwidth, by utilizing vertical interconnects and die/wafer stacking. This paper presents an overview of 3-D integration along with various design challenges and recent innovations.
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Corona: System Implications of Emerging Nanophotonic Technology
Dana Vantrease, Robert Schreiber, Matteo Monchiero et al. · 2008 · 461 citations · Full text
A design tradeoff study with monolithic 3D integration
Chang Liu, Sung Kyu Lim · 2012 · 77 citations
Engineering, Computer Engineering, Electrical Engineering +17