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Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices

Materials ScienceElectrical EngineeringEngineeringHardware ReliabilityCorrosionGold-tin SolderPhysic Of FailureThermo-mechanical DegradationsChip AttachmentElectronic PackagingPower Electronic AssembliesMicrostructurePower Electronic Devices