Failure analysis of LSI interconnection by terahertz time-domain reflectometry

Abstract

It is getting significant to identify the fault location in advanced IC packaging technology. However, challenges have been posed to precisely determine the fault location in the failure analysis process, which is difficult to be handled by the conventional electronic based time domain reflectometry. In this work, we developed a time-domain reflectometry technology with extremely small distance-to-fault measurement error less than 50 μm, which includes X-ray length measuring error, by introducing pulsed terahertz probing signal to Quad Flat Package.