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Fabrication and shear strength analysis of Sn-3.5Ag/Cu-filled TSV for 3D microelectronic packaging

Materials EngineeringMaterials ScienceMicroelectronic PackagingChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)3D Ic ArchitectureApplied PhysicsSn-3.5ag/cu-filled TsvHigh-performance MaterialMaterial PerformanceElectronic PackagingShear Strength Analysis3D PrintingMicrostructure