Do-Hyun Jung

Recent Advances in Active Metal Brazing of Ceramics and Process

S C Mishra, Ashutosh Sharma, Do-Hyun Jung et al. · Metals and Materials International · 2019 · 71 citations

Materials Science, Materials Engineering, Engineering +12

Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor

Do-Hyun Jung, Ashutosh Sharma, Jae Pil Jung · Journal of Alloys and Compounds · 2018 · 68 citations

Materials Science, Chemical Engineering, Cu Conductor +9

Review of the wettability of solder with a wetting balance test for recent advanced microelectronic packaging

Do-Hyun Jung, Jae Pil Jung · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 2018 · 48 citations

Engineering, Mechanical Engineering, Wetting Time +19

Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping

Do-Hyun Jung, Ashutosh Sharma, Keong-Heum Kim et al. · Journal of Materials Engineering and Performance · 2015 · 34 citations

Materials Science, Electrical Engineering, Engineering +5

Highly reliable driving workload analysis using driver electroencephalogram (EEG) activities during driving

J. Y. Kim, Changhyun Jeong, Myoungsoo Jung et al. · International Journal of Automotive Technology · 2013 · 34 citations

Driver Behavior, Eeg Signal Processing, Driver Electroencephalogram +6