Influence of different chemical surface patterns on the dynamic wetting behaviour on flat and silanized silicon wafers during inclining-plate measurements: An experimental investigation with the high-precision drop shape analysis approach

Publication | Closed Access

DOI

Citations

References

2016

Year

Florian Heib, Walid‐Madhat Munief, Sven Ingebrandt, Rolf Hempelmann, Michael Schmitt

Colloids and Surfaces A Physicochemical and Engineering Aspects

Silanized Silicon WafersWafer Scale ProcessingEngineeringExperimental InvestigationMicrofabricationSurface ScienceMechanical EngineeringApplied PhysicsWettingSemiconductor Device FabricationElectronic PackagingSilicon On InsulatorMicroelectronicsMicrostructureInclining-plate Measurements