Publication | Closed Access
Low-temperature sintering of highly conductive silver ink for flexible electronics
69
Citations
34
References
2016
Year
Materials EngineeringMaterials ScienceConductive Silver InkSinteringEngineeringFlexible ElectronicsMicrofabricationApplied PhysicsPrinted ElectronicsElectronic Packaging3D PrintingConductive Features
Development of a highly conductive, particle-free, durable and low-temperature sintered SOP ink for patterning conductive features using a broad-range of techniques.
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