2016 · 14 citations · 1 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsSemiconductor DevicesSemiconductor MaterialsChip PackagingIntegrated Circuit DevicesSemiconductor Device MaterialsSemiconductor ReliabilityThermal Properties Of SemiconductorsWide-bandgap Semiconductor DevicesEpoxy EncapsulationEpoxy ResinsGlass TransitionGlass Transition TemperatureInsulating MaterialsThermal ExpansionThermal Management Of Semiconductor DevicesThermostability
A newly IGBT module combined with liquid epoxy resin encapsulation and insulating metal baseplate (IMB) has been developed. IMB is insulating sheet with thick baseplate, and has large mounting area compared to ceramic substrate. The properties of liquid epoxy resin such as glass transition temperature, coefficient of thermal expansion, long-term thermostability are optimized for employed metal baseplate. Developed structure reduces solder cracks under semiconductor chip, and enhances lifetime of heat cycle test.
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