Influence of high-energy ball milling on electrical resistance of Cu and Cu/Cr nanocomposite materials produced by Spark Plasma Sintering

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Synthesis of nanostructured materials by mechanical milling: problems and opportunities

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Tensile properties of in situ consolidated nanocrystalline Cu

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Ultrahigh strength and high ductility of bulk nanocrystalline copper

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Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions

Wen‐Wei Wu, Sywert Brongersma, M. Van Hove et al. · Applied Physics Letters · 2004 · 229 citations

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