Ultrahigh strength and high ductility of bulk nanocrystalline copper

Abstract

We have synthesized artifact-free bulk nanocrystalline copper samples with a narrow grain size distribution (mean grain size of 23nm) that exhibited tensile yield strength about 11 times higher than that of conventional coarse-grained copper, while retaining a 14% uniform tensile elongation. In situ dynamic straining transmission electron microscope observations of the nanocrystalline copper are also reported, which showed individual dislocation motion and dislocation pile-ups. This suggests a dislocation-controlled deformation mechanism that allows for the high strain hardening observed. Trapped dislocations are observed in the individual nanograins.